Product description
LiPOLY PK404DM Two-Part Thermal Conductive Gap Filler is a two-part liquid gap filler, fast cured at room temperature or elevated tempera- ture. With a thermal conductivity of 3.6 W/m*K, PK404DM provides high thermal conductivity and low thermal impedance. It is ideally suited for dispensing using the dispensing robot or by syringe.
Features of LiPOLY PK404DM Two-Part Thermal Conductive Gap Filler
- Thermal conductivity: 3.6 W/m*K
- Fast curing in normal atmospheric temperature
- Great reliability
- Great sealing in low pressure
Applications of LiPOLY PK404DM Two-Part Thermal Conductive Gap Filler
- Between CPU and heat sink
- Between a component and heat sink
- Power supplies
- High speed mass storage drives
- Telecommunication hardware
- Electric vehicle& Automotive battery
- 5G base station & infrastructure
- EV electric vehicle
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs. With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with: Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.About Prostech
PROPERTY | PK404DM | TEST METHOD | UNIT |
Color | Blue (A part) White (B part) |
Visual |
– |
Solid content | 100% (Two-part : 100:100) | – | – |
Viscosity A | 47 | ISO 3219 | Pa.s |
Viscosity B | 48 | ISO 3219 | Pa.s |
Density | 3.0 | ASTM D792 | g/cm³ |
Shelf life | 24 months | – | – |
ROHS & REACH | Compliant | – | – |
SOLID(AFTER CURE) | |||
Thermal conductivity | 3.6 | ASTM D5470 | W/m*K |
Thermal impedance@10mils BLT | 0.252 | ASTM D5470 | °C-in²/ W |
Thermal impedance@20mils BLT | 0.471 | ASTM D5470 | °C-in²/ W |
Thermal impedance@30mils BLT | 0.730 | ASTM D5470 | °C-in²/ W |
Hardness | 80 | ASTM D2240 | Shore OO |
Working temp (long term) | -60 ~ 200 | – | °C |
Operating ambient temp | 20 ~ 30 | – | °C |
ELECTRICAL | |||
Dielectric breakdown | 8 | ASTM D149 | KV/mm |
Surface resistivity | >10¹⁰ | ASTM D257 | Ohm |
Volume resistivity | >10¹⁰ | ASTM D257 | Ohm-m |
CURE SCHEDULE | |||
Pot life @ 25°C | 10~15 | By LiPOLY | min |
Surface dry @ 25°C | 20~25 | By LiPOLY | min |
Cure @ 25°C | 25~30 | By LiPOLY | min |
Cure @ 100°C | 60 | By LiPOLY | sec |
Cure @ 120°C | 20 | By LiPOLY | sec |
