PERMABOND® ES569 is a single-part heat cured epoxy adhesive with excellent adhesion to metal surfaces as well as composite materials. The high bond strength of this adhesive allows it to replace mechanical fastening, soldering, brazing or welding. ES569 has been designed to be non-sagging, allowing the product to be used in large gaps and on vertical surfaces. It is also ideal for bonding electronic components as it has high wet strength and is non-stringing and produces an excellent drop profile as well as withstanding solder reflow processes.
FEATURES AND BENEFITS
- Excellent adhesive strength
- Excellent resistance to vibration
- Easy to use – no mixing required
- High shear and peel strength
- High temperature resistance
- Good resistance to chemicals
- Non-sag, thixotropic
Physical Properties of Uncured Adhesive
Chemical composition | Epoxy Resin |
Appearance | Black paste |
Viscosity @ 25°C | 250,000 to 500,000 mPa.s (cP) |
Specific gravity | 1.2 |
Typical Curing Properties
Flow at high temperature | No flow, high wet strength |
Maximum gap fill | 5 mm 0.2 in |
Cure speed (oven) * | 130° C (266°F): 75 minutes 150°C (300°F): 60 minutes 170°C (338°F): 40 minutes |
Cure speed (induction) | <3 minutes |
Typical Performance of Cured Adhesive
Shear strength* (ISO4587) | Steel 27 – 41 N/mm² (4000 – 6000 psi) Aluminium 17 – 31 N/mm² (2500 – 4500 psi) Zinc 14 – 27 N/mm² (2000 – 4000 psi) FRP Glass/Epoxy 9-11 N/mm² (1300–1600psi) Carbon Fibre 10-12 N/mm² (1450–1700psi) |
Peel strength (aluminium) (ISO 4578) |
100-120 N/25mm |
Hardness (ISO868) | 80-85 Shore D |
Coefficient of thermal expansion | 90 x 10-6 mm/mm/°C (under Tg) 180 x 10-6 mm/mm/°C (above Tg) |
Thermal conductivity | 0.5 W/(m.K) |
Glass transition temperature (Tg – DSC) |
130°C (266°F) |
