PERMABOND® ES558 is a single-part epoxy paste which flows like solder when heated during curing. The adhesive is toughened for maximum impact resistance, along with excellent peel and shear strength. ES558 is ideal for bonding a wide range of materials including metals, ferrites, ceramics and composites.
APPLICATIONS
- Excellent adhesive strength
- Excellent resistance to vibration
- Easy to use – no mixing required
- High shear and peel strength
- Good impact strength
- High temperature resistance
- Good resistance to chemicals
Physical Properties of Uncured Adhesive
|
Chemical composition |
Epoxy Resin |
|
Appearance |
Silver-grey |
|
Viscosity @ 25°C |
100,000 to 300,000 mPa.s (cP) |
|
Specific gravity |
1.5 |
Typical Curing Properties
|
Flow at high temperature |
Free flow |
|
Maximum gap fill |
0.5 mm 0.02 in |
|
Cure speed (oven) * |
130° C (266°F): 75 minutes 150°C (300°F): 60 minutes 170°C (338°F): 40 minutes |
|
Cure speed (induction) |
<3 minutes |
Typical Performance of Cured Adhesive
|
Shear strength* (ISO4587) |
Steel 27 – 41 N/mm² (4000 – 6000 psi) Aluminium 17 – 31 N/mm² (2500 – 4500 psi) Zinc 14 – 27 N/mm² (2000 – 4000 psi) |
|
Shear strength steel to ferrite |
>14 N/mm² (>2000 psi) Substrate failure |
|
Impact Strength (ASTM D- 950) |
25-35 KJ/m² |
|
Hardness (ISO868) |
80-85 Shore D |
|
E-modulus |
3.5 GPa |
|
Elongation at break (DIN 53504) |
<3% |
|
Coefficient of thermal expansion |
45 x 10-6 mm/mm/°C (below Tg) 160 x 10-6 mm/mm/°C (above Tg) |
|
Thermal conductivity |
0.9 W/(m.K) |
|
Glass transition temperature (Tg – DSC)) |
120°C (250°F) |
