LiPOLY T-top81-s offers outstanding thermal conductivity at 8.0 W/m*K and extremely low thermal resistance under minimal force. T-top81-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat.
FEATURE
- Thermal conductivity: 8.0 W/m*K
- High compression rate
- Extremely low thermal impedance
APPLICATION
- Between CPU and heat sink
- Between a component and heat sink
- Flat-panel displays
- Power supplies
- High speed mass storage drives
- Telecommunication hardware
- 5G base station & infrastructure
- EV electric vehicle
|
PROPERTY |
T-top81-s |
TEST METHOD |
UNIT |
|
Color |
Purple |
Visual |
– |
|
Surface tack 2-side/1-side |
2 |
– |
– |
|
Thickness |
Customized |
ASTM D374 |
mm |
|
Density |
3.4 |
ASTM D792 |
g/cm³ |
|
Hardness |
35 |
ASTM D2240 |
Shore OO |
|
TML |
<0.1 |
By LiPOLY |
% |
|
Application temperature |
-60~150 |
– |
°C |
|
ROHS & REACH |
Compliant |
– |
– |
|
COMPRESSION |
|||
|
Deflection @10 psi |
7 |
ASTM D5470 modify |
% |
|
Deflection @20 psi |
20 |
ASTM D5470 modify |
% |
|
Deflection @30 psi |
43 |
ASTM D5470 modify |
% |
|
Deflection @40 psi |
64 |
ASTM D5470 modify |
% |
|
Deflection @50 psi |
68 |
ASTM D5470 modify |
% |
|
ELECTRICAL |
|||
|
Dielectric breakdown |
8 |
ASTM D149 |
KV/mm |
|
Surface resistivity |
>10¹¹ |
ASTM D257 |
Ohm |
|
Volume resistivity |
>10¹⁰ |
ASTM D257 |
Ohm-m |
|
Dielectric constant@10MHz Dk |
10.2 |
ASTM D150 |
– |
|
Dielectric constant@1GHz Dk |
10.1 |
ASTM D150 |
– |
|
Dielectric constant@1.8GHz Dk |
10.8 |
ASTM D150 |
– |
|
Dielectric factor@10MHz Df |
0.006 |
ASTM D150 |
– |
|
Dielectric factor@1GHz Df |
0.002 |
ASTM D150 |
– |
|
Dielectric factor@1.8GHz Df |
0.021 |
ASTM D150 |
– |
|
THERMAL |
|||
|
Thermal conductivity |
8.0 |
ASTM D5470 |
W/m*K |
|
Thermal Conductivity |
5.5 |
ISO 22007-2 |
W/m*K |
|
Thermal impedance@10psi |
0.260 |
ASTM D5470 |
°C-in²/ W |
|
Thermal impedance@20psi |
0.221 |
ASTM D5470 |
°C-in²/ W |
|
Thermal impedance@30psi |
0.148 |
ASTM D5470 |
°C-in²/ W |
|
Thermal impedance@40psi |
0.122 |
ASTM D5470 |
°C-in²/ W |
|
Thermal impedance@50psi |
0.112 |
ASTM D5470 |
°C-in²/ W |
|
Coefficient of thermal expansion |
-236.67×10ˉ⁶ |
ASTM E228 |
1/K |
