LOCTITE® ABLESTIK 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automated die attach equipment. The rheology of LOCTITE ABLESTIK 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one of the most widely used die attach materials in the semiconductor industry.
Key Features:
Conductive
Box oven cure
Excellent dispensability, minimal tailing and stringing
Applications:
Die Attach
Đặc điểm
Gía trị
Chỉ số lưu biến (0.5/5 rpm)
5.6
Độ nhớt, Brookfield CP51, 25 °C, mPa·s (cP):
Tốc độ 5 rpm
8000
Thời gian thao tác @ 25°C, thời gian thao tác vật lý bởi % hạt filler, giờ
