Thermal interface materials or TIMs can be defined as any material applied between the interfaces of two components. These materials enhance the thermal coupling between electronic devices. Usually, TIMs are used between a heat generating device (microprocessor, photonic integrated circuits, etc.) and a heat dissipating device (e.g. heat sink) to remove the heat from the component.
WHY THERMAL MATERIALS – TIMs?
The effective transfer/removal of heat from a semiconductor device is crucial to ensure reliable operation and to enhance the lifetime of these components. Microscopic surface roughness and non-planarity of the IC/heat spreader and heat sink surfaces result in asperities between the two mating surfaces. These asperities prevent the two solid surfaces from forming a thermally perfect contact due to the poor thermal conductivity of air that exists in the gaps between two mating surfaces.
TIMs are therefore used to provide an effective heat conduction path between the solid surfaces due to their conformation (under pressure) to surface roughness and reasonably high thermal conductivity.
