TG-S606C is a silicone based thermal grease that has been designed for high performance CPUs and similar applications. It has a thermal conductivity of 5 W/mK, superior wetting characteristics, resulting in a very low thermal resistance and excellent long term reliability.
FEATURES
- Good thermal conductivity
- Easy to assemble
- High stability
- Does not harden with time
APPLICATIONS
- Electronic components: IC, CPU, MOS
- LED, M/B, P/S, Heat Sink
- LCD, TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
- DDR II Module, DVD Applications, Hand-set applications, etc.
| Property | S606C | Unit | Test Method |
| Colour | Grey | – | Visual |
| Thermal Conductivity | 5 | W/mK | ASTM D5470 |
| Weight Loss | <0.5 | % | ASTM E595 |
| Density | 2.3 | g/cm³ | ASTM D792 |
| Working Temperature | -40 to 180 | ºC | – |
| Volume Resistance | >10¹² | Ohm-cm | ASTM D257 |