TECHNOMELT® PA 646 BLACK is a one-component Polyamide Hot Melt Adhesive designed to meet low pressure molding process requirements. This product can be processed at low molding pressure due to its low viscosity, allowing encapsulation of fragile components without damage.
Specific gravity @ 20°C, g/cm3
ISO 1183 0.98
Softening point, °C
ASTM E28 (in glycerin) 170 to 180
Melt Viscosity – RVT, mPa·s (cP)
ASTM D 3236 (spindle 27)
@210ºC 6,500
@220ºC 4,500
@225ºC 3,000 to 5,500
@230ºC 3,000