Soder-Wick 80-3-10 offers the state of the art in desoldering technology. Soder-Wick is designed for today’s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage. A full range of sizes and flux types are available, including Rosin, No Clean, unfluxed and a high temperature Lead-Free version. Whatever the requirement, Soder-Wick has the answer.
FEATURES:
- Requires little or no post solder cleaning
- No corrosive residues
- Optimized construction for faster wicking and heat transfer
- Halide free
- Minimizes the risk of heat damage to components and circuit boards
TYPICAL APPLICATIONS: Soder-Wick 80-3-10 desoldering braid safely removes solder from:
- Thru-hole Components
- SMT Pads and BGA Pads
- Micro Circuits
- Terminals
- Lugs and Posts
- Identification Script
| Flux Types | Rosin Grade WW, Type “R” Patented No Clean High Temperature No Clean |
| Specifications | ANSI/IPC J STD-004 MIL-F-14256 F |
| No Clean Flux Spec | MIL-STD-883B Bellcore TR-NWT-000078 ANSI/IPC J SF818 |
| Shelflife | 2 years |
