Product description
Bostik Kizen® HEAT HOT MELT ADHESIVE, ideal for end of line packaging, including case and carton sealing and tray erecting, Kizen HEAT is the high temperature grade hot melt adhesive in the Kizen product line.
Based on a water-white technology, Kizen FORCE is designed for ease of use, offering fast set speeds and adhesion to a variety of packaging substrates. It also possesses outstanding thermal stability, aiding in low maintenance, char-free operations.
Furthermore, as part of the Kizen product line, Kizen FORCE offers tailored rheology, which facilitates ultra-precise application and clean cut off. Additionally, its low viscosity and excellent specific adhesion enable strong bonds.
Features of Bostik Kizen® HEAT HOT MELT ADHESIVE
- Superior Temperature Resistance
- Excellent resistance to hot fill and extreme shipping conditions
- Outstanding thermal stability and ultra-precise drops
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs. With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with: Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.About Prostech
TYPICAL PROPERTIES* | |
Description | Results |
Thermosel Viscosity (Brookfield – ASTM D3236) | 1,165 cP @ 375°F 1,700 cP @ 325 °F 2,330 cP @ 300°F |
Softening Point (Ring and Ball Herzog – ASTM E28) | 224°F |
Suggested Running Temperature | 350 – 375°F |
