Product description
Bergquist TGF 3010APS Gap Filler is a two-part, silicone-free thermal interface material that cures at room temperature and is suitable for assembly applications. With a thermal performance of 3.0 W/m-K, this product provides an excellent silicone-free solution, which is crucial for lithium-ion battery energy storage applications. This material is an ideal choice for use in automotive and consumer applications.
Features and Benefits of Bergquist TGF 3010APS Gap Filler
- Thermal conductivity: 3.0 W/m-K
- Silicone-free, liquid form
- Cures at room temperature – no need for an oven
- Extremely high dispensing rate: >40 cc/sec
- Low compressive stress during assembly
Applications of Bergquist TGF 3010APS Gap Filler
- Automotive energy storage
- Applications sensitive to silicone
- Processes requiring high dispensing speed
- Applications needing high thermal conductivity and low compressive stress
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs. With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with: Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.About Prostech
| Property | BERGQUIST GAP FILLER TGF 3010APS (A) | BERGQUIST GAP FILLER TGF 3010APS (B) |
|---|---|---|
| Viscosity, mPa·s (cP) | ||
| High shear rate 3000 s⁻¹, ASTM D5099 | 5,000 | 20,000 |
| Low shear rate 1.0 s⁻¹, DIN 53019 | 425,000 | 650,000 |
| Density, ASTM D792, g/cc | 3.0 | 3.0 |
| Shelf life @ 25°C, days | 90 | 90 |
Cured Material Properties
Physical Properties
| Property | Value |
|---|---|
| Hardness, Shore 00, 6.35 mm (thick sample) | 75 |
| Specific heat capacity, ASTM D1269, J/g-K | 0.87 |
| Flammability, UL 94 | V-0 |
| Siloxane content, ΣD4-D10, ASTM F2466, ppm | ND |
Electrical Properties
| Property | Value |
|---|---|
| Dielectric strength, ASTM D149, V/mm | 14,000 |
| Dielectric constant, ASTM D150 @ 1000 Hz | 17 |
| Volume resistivity, ASTM D257, ohm-meter | 1×10⁶ |
Thermal Properties
| Property | Value |
|---|---|
| Thermal conductivity, ASTM D5470, W/(m-K) | 3.0 |
