LOCTITE ABLESTIK ABP 2024 is non-conductive die attach adhesive has been formulated for use in high throughput die-attach applications. This material is designed to minimize stress and resulting warpage between the dissimilar surfaces. It is formulated to have low outgassing at 260ºC and eliminate contamination in cavity package applications requiring reflow.
FEATURES
- Low outgassing
- One component
- High reliability
- Packaging type: Syringe
APPLICATIONS OF ABP 2024
- Compact Camera Module – Die attach
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs. With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with: Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.About Prostech
Cure Type | Heat |
Appearance | White |
Viscosity (Brookfield) 25°C, 5 rpm | 13,000 |
Glass Transition Temperature (Tg) | 47 |
Modulus @ 25°C | 510 |
CTE Below Tg | 127 |
CTE Above Tg | 156 |
Recommended Cure | 30 min. @ 150°C |