LOCTITE ABLESTIK ABP 2024, BMI hybrid die, attach adhesive
LOCTITE ABLESTIK ABP 2024 is non-conductive die attach adhesive has been formulated for use in high throughput die-attach applications. This material is designed to minimize stress and resulting warpage between the dissimilar surfaces.
FEATURES:
- Low outgassing
- One component
- High reliability
RECOMMENDED APPLICATIONS:
- Compact Camera Module – Die attach
Cure Type | Heat |
Appearance | White |
Viscosity (Brookfield) 25°C, 5 rpm | 13,000 |
Glass Transition Temperature (Tg) | 47 |
Modulus @ 25°C | 510 |
CTE Below Tg | 127 |
CTE Above Tg | 156 |
Recommended Cure | 30 min. @ 150°C |