LiPOLY BS75K is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K.BS75K offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts.
FEATURE
- Thermal conductivity: 3.0 W/m*K
- High compression rate
- Low thermal impedance
- High recovery
- Available in a range of thicknesses
APPLICATION
- Between CPU and heat sink
- Between a component and heat sink
- Notebook computers
- Power supplies
- High speed mass storage drives
- Telecommunication hardware
- 5G base station & infrastructure
- EV electric vehicle
|
PROPERTY |
BS75K |
TEST METHOD |
UNIT |
|
Color |
Dark Gray |
Visual |
– |
|
Surface tack 2-side/1-side |
2 |
– |
– |
|
Thickness |
Customized |
ASTM D374 |
mm |
|
Density |
2.6 |
ASTM D792 |
g/cm³ |
|
Hardness |
18 |
ASTM D2240 |
Shore OO |
|
Application temperature |
-60~180 |
– |
°C |
|
ROHS & REACH |
Compliant |
– |
– |
|
COMPRESSION@1.0mm |
|||
|
Deflection @10 psi |
35 |
ASTM D5470 modify |
% |
|
Deflection @20 psi |
39 |
ASTM D5470 modify |
% |
|
Deflection @30 psi |
43 |
ASTM D5470 modify |
% |
|
Deflection @40 psi |
46 |
ASTM D5470 modify |
% |
|
Deflection @50 psi |
48 |
ASTM D5470 modify |
% |
|
ELECTRICAL |
|||
|
Dielectric breakdown |
12 |
ASTM D149 |
KV/mm |
|
Surface resistivity |
>10¹⁰ |
ASTM D257 |
Ohm |
|
Volume resistivity |
>10¹¹ |
ASTM D257 |
Ohm-m |
|
THERMAL |
|||
|
Thermal Conductivity |
3.0 |
ASTM D5470 |
W/m*K |
|
Thermal impedance@10 psi |
0.562 |
ASTM D5470 |
°C-in²/ W |
|
Thermal impedance@20 psi |
0.543 |
ASTM D5470 |
°C-in²/ W |
|
Thermal impedance@30 psi |
0.504 |
ASTM D5470 |
°C-in²/ W |
|
Thermal impedance@40 psi |
0.485 |
ASTM D5470 |
°C-in²/ W |
|
Thermal impedance@50 psi |
0.463 |
ASTM D5470 |
°C-in²/ W |
