JONES 21-745, phase change interface thermal material, is designed to maximize heat sink performance and improve component reliability. It minimizes thermal resistance at interfaces and maintains excellent performance when it fills interfacial gaps and voids. At room temperature, JONES 21-745 is solid and easy to handle. This allows it to be consistently and cleanly applied as dry pad to heat sink or component surface. Upon reaching its softening temperature of 50 ℃, PCM 21-745 begins to soften and flow, filling the microscopic irregularities of the component. The result is an interface with minimal bond-line thickness and thermal contact resistance.
FEATURE
Low Thermal Resistance
RoHS Compliant
Phase Change ~ 50 °C
Excellent Interface Wetability
High Reliability
Form:Pad
APPLICATION OF JONES 21-745
CPUs (Notebooks,Desktops, Servers)
Chipsets
GPUs
ASICS Chips
Smart Phones
Form: Pad
ABOUT PROSTECH
Prostech provides specialized manufacturing and bonding solutions for a wide range of industries, serving as an authorized distributor of leading global manufacturers of industrial materials and equipment. Our product range is focused and in-depth, with the aim of delivering “customized” solutions tailored to each customer’s specific applications and needs. Browse our full selection of products here.
Our dedicated technical team is always ready to assist our customers in:
Testing sample quality and verifying product compatibility in our laboratory
Providing expert advice on suitable equipment and automation processes
Customizing material formulas to meet special application requirements
Customizing product sizes, quantities, and packaging according to customer needs
Offering technical training and on-site support to ensure optimal use of our products
Prostech ensure the safe and acurrate delivery of all types of materials, including “dangerous goods,” in compliance with legal regulations.
