JONES Thermal Pad 21-881 is an ultra soft putty like gap filling material rated at a thermal conductivity of 8.0 W/m-K. It is conformable to uneven and rough surfaces, where require excellent compressibility to the thermal gap filler.Its soft construction offers high conformability and imparts minimum pressure to electronic components.
FEATURE
- Thermal Conductivity :8.0W/m·K
- Ultra Soft (Putty Like)
- Extremely Good Thermal Performance
- Excellent Surface Wetting
- High Breakdown Voltage
- Easy For Installation
APPLICATION
- Memory Modules
- Mass Storage Devices
- Automotive Electronics
- Telecommunication Hardware
- Radios
- Audio And Video Players
- IT Infrastructure
Properties | Thermal Pad 21-881 | Test Method | |
Thermal | Thermal Conductivity (W/m·K) | 8.0 | ASTM D5470 |
Operating Temperature Range(℃) | -55~150 | JONES Test Method | |
Physical | Color | Blue | Visual |
Composition | Ceramic&Silicone | – | |
Density (g/cm^3) | 3.2 | ASTM D792 | |
Thickness Range (mm) | 1.0~5.0 | ASTM D374 | |
Thickness Tolerance(mm)> 1mm | ±10% | – | |
Hardness (Shore 00) | 50 | ASTM D2240 | |
Electrical | Breakdown Voltage (KV AC/mm) | >5 | ASTM D149 |
Volume Resistivity (Ohm·cm) | 10^13 | ASTM D257 | |
Dielectric Constant@1MHz | 6.6 | ASTM D150 | |
Regulatory | Flame Rating | V0 | UL 94 |
