JONES 21-869-150-0660 is an ultra soft putty like gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is highly conformable to uneven and rough surfaces, where require the thermal gap filler material has a characteristics of over 50% compressibility. Its soft construction offers high conformability and effectively reduces thermal resistance. JONES Thermal Pad 21-869 is natually tacky and 21-869A is single-side tacky, both of which facilitate easy handling and simplified application.
FEATURE
- Thermal Conductivity :7.0W/m·K
- Ultra Soft (Putty Like)
- Extremely Good Thermal Performance
- Excellent Surface Wetting
- High Breakdown Voltage
- Easy For Installation
APPLICATION OF JONES 21-869-150-0660
- Memory Modules
- Mass Storage Devices
- Automotive Electronics
- Telecommunication Hardware
- Radios
- Power Electronics
- Set-Top Boxes
- IT Infrastructure
ABOUT PROSTECH
Prostech provides specialized manufacturing and bonding solutions for a wide range of industries, serving as an authorized distributor of leading global manufacturers of industrial materials and equipment. Our product range is focused and in-depth, with the aim of delivering “customized” solutions tailored to each customer’s specific applications and needs. Browse our full selection of products here.
Our dedicated technical team is always ready to assist our customers in:
- Testing sample quality and verifying product compatibility in our laboratory
- Providing expert advice on suitable equipment and automation processes
- Customizing material formulas to meet special application requirements
- Customizing product sizes, quantities, and packaging according to customer needs
- Offering technical training and on-site support to ensure optimal use of our products
Prostech ensure the safe and acurrate delivery of all types of materials, including “dangerous goods,” in compliance with legal regulations.
Contact us today for quotation!
