JONES Thermal Grease 21-430 is a silicone based, high performance thermal interface material. It is designed to perform high thermal conductivity between high watt density chips like CPUs, GPUs, ASIC, Northbridge chipsets and heat sink. It demonstrates outstanding thermal performance and high reliability while wetting out the thermal interfaces under assembly pressure.
FEATURE
- Thermal Conductivity: 3.3W/m·K
- Moderate Viscosity For Easy Application
- No post “Cure” required
- High Thermal Conductivity
- No Dry Out @150℃
- Solvent-free
APPLICATION
- CPUs (Notebooks, PCs, Servers)
- LED Solid State Lighting
- GPUs’
- Northbridge Chipsets
- ASICS Chips
Properties | Thermal Grease 21-430 |
Test Method | |
Thermal | Thermal Conductivity (W/m·K) | 3.3 | HOT DISK |
Thermal Resistance @40 psi (°C·cm^2/W) | 0.119 | ASTM D5470 | |
Operating Temperature Range(°C) | -40~150 | JONES Test Method | |
Physical | Composition | Ceramic&Silicone | – |
Color | Grey | Visual | |
Typical Minimum Bondline Thickness (μm) | 50 | JONES Test Method | |
Viscosity @20rpm (Pa·s) | 350 | ASTM D2196 | |
Density (g/cm³) | 2.4 | ASTM D792 | |
Electrical | Breakdown Voltage (KV AC /mm) | >5.0 | ASTM D149 |
Volume Resistivity (Ohm·cm) | 10^13 | ASTM D257 | |
Dielectric Constant @1MHz | 5.3 | ASTM D150 | |
Regulatory | Flame Rating | V0 | UL 94 |
