JONES 21-869 is an ultra soft putty like gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is highly conformable to uneven and rough surfaces, where require the thermal gap filler material has a characteristics of over 50% compressibility. Its soft construction offers high conformability and effectively reduces thermal resistance.
FEATURES AND BENEFITS
- Thermal Conductivity :7.0W/m·K
- Ultra Soft (Putty Like)
- Extremely Good
- Thermal Performance
- Excellent Surface
- Wetting
- High Breakdown Voltage
- Easy For Installation
APPLICATIONS OF JONES 21-869
- Memory Modules
- Mass Storage Devices
- Automotive Electronics
- Telecommunication
- Hardware
- Radios
- Power Electronics
- Set-Top Boxes
- IT Infrastructure
ABOUT PROSTECH
Prostech provides specialized manufacturing and bonding solutions for a wide range of industries, serving as an authorized distributor of leading global manufacturers of industrial materials and equipment. Our product range is focused and in-depth, with the aim of delivering “customized” solutions tailored to each customer’s specific applications and needs. Browse our full selection of products here.
Our dedicated technical team is always ready to assist our customers in:
- Testing sample quality and verifying product compatibility in our laboratory
- Providing expert advice on suitable equipment and automation processes
- Customizing material formulas to meet special application requirements
- Customizing product sizes, quantities, and packaging according to customer needs
- Offering technical training and on-site support to ensure optimal use of our products
Prostech ensure the safe and acurrate delivery of all types of materials, including “dangerous goods,” in compliance with legal regulations.
Contact us today for quotation!
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21-869 TYPICAL PROPERTIES |
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Properties |
Typical Properties |
Test Method |
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Thermal |
Thermal Conductivity (W/m·K) |
7.0 |
ASTM D5470 |
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Operating Temperature Range (°C) |
-55~150 |
JONES Test Method |
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Physical |
Color |
Gray pink |
Visual |
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Composition |
Ceramic&Silicone |
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Density (g/cm^3) |
3.0 |
ASTM D792 |
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Thickness Range (mm) |
1.0~5.0 |
ASTM D374 |
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Thickness Tolerance(mm)> 1mm |
±10% |
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Hardness (Shore 00) |
35 |
ASTM D2240 |
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Electrical |
Breakdown Voltage (KV AC/mm) |
>5 |
ASTM D149 |
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Volume Resistivity (Ohm·cm) |
10^12 |
ASTM D257 |
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Dielectric Constant@1MHz |
6.0 |
ASTM D150 |
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Regulatory |
Flame Rating |
V0 |
UL94 |
