JONES 21-335 is a one-part curable thermal gel, based on silicone substrate, for thermal gap filling application. It is very soft and has good shape retention performance.
FEATURES AND BENEFITS
- Thermal Conductivity :3.5W/m·K Heat Cured
- Easily dispensable
- Low Thermal Resistance
- Low Bond Line Thickness
- No Oil Bleeding
- Electrically Isolating.
APPLICATIONS OF JONES 21-335
- Mass Storage Devices
- Automotive Electronics
- Telecommunication Hardware
- AR/VR
- LED Solid State Lighting
- Power Electronics
ABOUT PROSTECH
Prostech provides specialized manufacturing and bonding solutions for a wide range of industries, serving as an authorized distributor of leading global manufacturers of industrial materials and equipment. Our product range is focused and in-depth, with the aim of delivering “customized” solutions tailored to each customer’s specific applications and needs. Browse our full selection of products here.
Our dedicated technical team is always ready to assist our customers in:
- Testing sample quality and verifying product compatibility in our laboratory
- Providing expert advice on suitable equipment and automation processes
- Customizing material formulas to meet special application requirements
- Customizing product sizes, quantities, and packaging according to customer needs
- Offering technical training and on-site support to ensure optimal use of our products
Prostech ensure the safe and acurrate delivery of all types of materials, including “dangerous goods,” in compliance with legal regulations.
Contact us today for quotation!
