JONES Thermal Pad 21-1500 is a soft and super high thermal conductive material. It is conformable to uneven and rough surfaces, where require excellent compressibility to the thermal gap filler.Its soft construction offers high conformability and imparts minimum pressure to electronic components.
FEATURES AND BENEFITS
High thermal conductivity: 15W/m-K in thickness direction Soft: Outstanding compressibility Carbon fiber aligning
APPLICATIONS
- Base station, IGBT module｜
- Optical transceiver｜Mass Storage Devices｜
- Power Electronics
21-1500 TYPICAL PROPERTIES | ||||||
| Properties | Typical Properties | Test Method | |||
Thermal |
Thermal Conductivity (W/m·K) | 21-1500(non-tacky) | 15 |
ASTM D5470 | ||
21-1500A(single-side tacky) | 13 | |||||
Thermal Resistance(°C.in^2/W) | Thickness(mm) | 1.0 | 2.0 | 3.0 | ASTM D5470 | |
Thermal resistance @10Psi pressure(°C*cm2/W) | 0.84 | 1.39 | 1.87 | |||
Operating Temperature Range(°C) | -55~150 | JONES Test Method | ||||
Physical | Color | Dark Gray | Visual | |||
Hardness(Shore 00) | 50 | ASTM D2240 | ||||
Density (g/cm^3 ) | 2.62 | ASTM D792 | ||||
Thickness Range (mm) | 1.0~5.0 | ASTM D374 | ||||
Electrical | Breakdown Voltage (KV AC/mm) | <0.1 | ASTM D149 | |||
Volume Resistivity (Ohm·cm) | >10^5 | ASTM D257 | ||||
Regulatory | Flame Rating | V0 | UL94 | |||
