JD322 is a one component epoxy adhesive for electronic devices bonding. This product exhibits good adhesion strength. This resin can be fast cured at low temperature and is suited for different kinds of materials bonding, it is especially good for plasitcs bonding. The durability level of this product is very high and this resin can pass many environmental test experiments. This product is well suited for heat sensitive components bonding, such as memory cards and C-MOS assembling.
FEATURES
1. This product is solvent-free and non-volatile system.
2. The hardening surface will not exhibit a surface oiliness. Cured product has poor gloss.
3. This resin offers excellent retention of electrical insulation properties under high humidity conditions.
4. This resin offers excellent chemical resistance and solvent resistance.
5. It is highly vibrate-resist at ordinary temperature.
6. This resin has excellent dimensional stability over a wide temperature range.
7. This product complies to the 2011 /65 E U RoHS regulations
8. This product complies to chlorine < 900ppm, bromine < 900ppm, chlorine + bromine <1500ppm
Typical Uncured Properties
| Appearance | Liquid |
| Color | Black |
| Viscosity 25oC, S14 5rpm, cps | 128,000 ~ 192,000 |
| Thixotropic Index | 4~6 |
| Filler grain size, um | 2~5 (Max<10) |
| Filler ratio, % | 23 |
| Chloride (Cl), ppm | <50 |
| Potassium (K), ppm | <10 |
| Sodium (Na), ppm | <30 |
Typical Cured Properties
| Glass Transition Temp.,(DSC), oC | 132 |
| CTE*8 ((<Tg ), μm/ oC | 48 |
| CTE*8 ((>Tg ), μm/ oC | 162 |
| Specific Heat 25oC, J/goC | 1.01 |
| Durometer Hardness, Shore D | 90 |
| Dielectric Strength, KV/mm | 16 |
