HFC – MFZ series comprehensive conductive foam is made of polyurethane foam and terylene fibre composite, its conductive all-round after plating process, and suitable for die cutting and laminating after attached with pressure sensitive adhesive, widely used in computers, cell phones and other kinds of electronic products, mainly in the high frequency transmission cover or isolate the interference of electromagnetic waves or radio waves.
FEARURES:
- Good resilience
- Excellent all-directional conductivity
- Good performance on EMI shield effectiveness
- RoHS compliant,halogen free
- Conductive pressure sensitive adhesive has strong viscosity, can be fully fit with the product, it’s hard to separate
| Item | Parameter | Test method |
| Color | Gray | Visual |
| Thickness(mm) | 0.5-6 | GB/T 451.3 |
| Tolerance(mm) | ±0.3-±0.5 | GB/T 451.3 |
| Surface Resistance (Ω/Inch2) | ≤0.2 | GB/T 30139 |
| Vertical resistance(Ω) | ≤0.2 | GB/T 30139 |
| Adhesion(Kg/inch) | ≥1.0 | GB/T 2792 |
| Recommended compression% | 30&-50% | |
| Shielding Effectiveness（dB） | ≥90(20MHz-2GHz) | GB/T 30142 |
| Salt spray test | PH=6.5 48h，Level A-10 | ASTM.B117 |
| Temperature Tolerance（℃） | Short Term:-40~120℃; Long Term:-20～85℃ |
