Product Description
Chemtronics 80-1-5 Soder-Wick offers the state of the art in desoldering technology. Soder-Wick® is designed for today’s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick® responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage. All wick is sealed in nitrogen-purged packaged to avoid corrosion and loss of performance from moisture and oxygen.
Key Feature of Chemtronics 80-1-5 Soder-Wick
- Requires little or no post solder cleaning
- No corrosive residues
- Optimized construction for faster wicking and heat transfer
- Halide free
- Minimizes the risk of heat damage to components and circuit boards
Application of Chemtronics 80-1-5 Soder-Wick
- Thru-hole Components
- SMT Pads and BGA Pads
- Micro Circuits
- Terminals
- Lugs and Posts
- Identification Script
View all Chemtronics product here
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| Typical Product Data and Physical Properties | Soder-Wick Is Designed To Meet or Exceed the Following: |
|---|---|
| Flux Type: Rosin Grade WW, Type “R” | MIL-F-14256F, Type R |
| Specifications: ANSI/IPC J STD-004, MIL-F-14256 F | NASA-STD-8739.3 |
| Shelf Life: 2 years | DOD-STD-883E, Method 2022 |
| RoHS Compliant: Yes | ANSI/IPC J STD-004, Type ROLO |
| BELLCORE TR-NWT-000078 | |
| ANSI/IPC J SF-818 |
