Bectron® PK 4353 is a one-component resin system which cures to form a semi-flexible polyurethane duroplastic. It comprises a liquid polyol system with a dispersed solid encapsulated polyisocyanate and a pigment combination selected to provide controlled rheology including excellent thixotropic properties. Heating the resin releases the encapsulated polyiso-cyanate resulting in a polyaddition reaction to give a resistant duroplastic cured material.
It is available in blue.
In contrast to the usual 2 component resin systems Bectron® PK 4353 is ready to use and distinguished by excellent properties and especially good environ-mental compatibility.
Properties of Bectron® PK 4353 in cured condition
The cured material displays high elasticity and strength resulting in very good temperature cycling behaviour within the range of -50°C to +125°C as well as good resistance to vibrations. Bectron® PK 4353 has excellent chemical resistance to a wide range of aggressive liquids common in automotive applications. Bectron® PK 4353 also displays very good adhesion to most materials used in the electronic field. Even after several temperature cycles there is no loss of adhesion, and the level of mechanical and electrical properties is maintained.
Satisfies ROHS Directive.
Applications of Bectron® PK 4353
The cured Bectron® PK 4353 is a semi-flexible duro-plastic suitable for chemical and shock protection of components. Bectron® PK 4353 is therefore most suited for the partial or selective coating of SMD and other compo-nents groups on printed circuit boards and ceramic substrates. It is also used as a casting/potting resin for electronic components and sensors, automotive electronics, plugs etc.
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Properties of component as supplied
Property
Condition
Value
Unit
Viscosity, DIN 53019
D=15 s-1 23°C
,
3.500 ± 500
mPa.s
Density, DIN 51757
23°C
1,33 ± 0,02
g/cm³
Shelf life
23°C
7
months
Gel-time, curing conditions
Property
Value
Value
Unit
Temperature
80
90
°C
Gel-time
5 ± 2
min
Curing
65 ± 5
30 ± 5
min
Here are BECTRON® PK-Series (1 Component, heat-curing)