Henkel Loctite Ablestik 55, formerly Emerson and Cuming ECCOBOND, is a two component, unfilled, epoxy adhesive resin that is used for electronic assemblies, anchoring inserts, hermetic sealing, and bonding of plastics, metal, ceramics, and glass. It offers low viscosity, good wetting, and resistance to water, chemicals, and solvents
| Typical Use: | Used for electronic component assembly, staking of adjustment and calibration screws and anchoring inserts, end fills or hermetic sealing. |
| Brand: | Ablestik |
| Chemical Composition: | Epoxy |
| Color: | Milky White |
| Components: | 2 part |
| Cure System: | Room Temperature/Heat |
| Cure Time: | Catalyst 9: 16 to 24h @ 25 °C; Catalyst 11: 8 to 16h @ 80 °C; Catalyst 23LV: 24h @ 25 °C |
| Dielectric Strength: | Catalyst 9: 17 kV/mm |
| Flash Point: | 254 °C |
| Mix Ratio: | Catalyst 9: 100:15.5 by volume, 100:13.5 by weight; Catalyst 11: 100:17 by volume, 100:16 by weight; Catalyst 23LV: 100:32 by volume, 100:28 by weight |
| Service Temperature: | Catalyst 9: -40 to 130 °C; Catalyst 11: -55 to 155 °C; Catalyst 23LV: -65 to 105 °C |
| Shear Strength: | Catalyst 9: 1,700 @ 25 °C |
| Specific Gravity: | 1.18 |
| Viscosity: | Catalyst 9: 8,000; Catalyst 11: 7,100; Catalyst 23LV: 3,300 |
| Volume Resistivity: | Catalyst 9: >1 x 10^15 ohm-cm @ 25 °C |
| Working Time: | Catalyst 9: 45min @ 25 °C; Catalyst 11: >4h @ 25 °C ; Catalyst 23LV: 60min @ 25 °C |