LiPOLY S-putty5-s is a one-part dispensable material with thermal conductivity 10.0 W/m*K. High deformation can fill small air gaps perfectly

LiPOLY SH-putty3 is a one-part dispensable material with thermal conductivity 8.0 W/m*K. High defor- mation can fill small air gaps

LiPOLY H-putty2 is a one-part dispensable material with thermal conductivity 6.0 W/m*K. High defor- mation can fill small air gaps

LiPOLY H-putty is a one-part dispensable material with thermal conductivity 3.5 W/m*K. High deforma- tion can fill small air gaps

LiPOLY S-putty2-s is a one-part dispensable material with thermal conductivity 6.0 W/m*K. High defor- mation can fill small air gaps

LiPOLY S-putty is a one-part dispensable material with thermal conductivity 3.5 W/m*K. High deforma- tion can fill small air gaps

Why is Thermal Management so crucial in Electronic packaging? Up to 55% of failures on electronic circuit boards are caused

Easy to dispense and maintain TIMs, beyond good thermal conductivity and reducing trouble air gaps features. What are Thermally Conductive

  Why thermal management in PCBs?  1. Higher density of components in PCBs surface   The electronic industry field is

BERGQUIST® TGR 4000 is a thermally conductive grease compound designed for use as a thermal interface material between a computer

TIG830SP is a silicone grease that provides high thermal conductivity and low thermal resistance. The worability of TIG830SP makes it

Thermal interface materials or TIMs are any material that is applied between the interfaces of two components to enhance the