tesa® Low Temperature Reactive (LTR) 8722 is a reactive mounting tape activated at moderate temperatures. This translucent double-sided tape has no backing. It is protected by a PE-coated paper liner. It is activated by moderate heat and pressure applied during the assembly process.
FEATURES of tesa® LTR 8722 mounting tape
- Extremely high bonding performance and reliability, even on slim bonding areas and thin design gaps
- Activated at low temperature and pressure
- Excellent shock resistance
- Sebum resistant
- Very low oozing ratio
- At room temperature tesa® LTR 8722 is not tacky.
- tesa® LTR 8722 is free of halogen and compliant with current RoHS directive.
APPLICATIONS of tesa® LTR 8722 mounting tape
- Bonding of plastics
- Bonding of fabrics and leather
- Mounting of sensitive electronic parts
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About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:
- Provide quotation, sample, TDS/MSDS, and technical consultation
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1. Pre-lamination:
During pre-lamination, laminate the adhesive tape onto the first component.
Machine setting:
- Temperature¹ 50-60 °C
- Pressure² 1 – 3 bar
- Time 5 – 20 s
Short-time exposure to 60°C bond line temperature during pre-lamination does not impact final bonding potential.
2. Bonding:
Remove the liner from tape after the pre-lamination step. Position the second component. Apply temperature and pressure for the bonding time to reach sufficient bonding strength.
Setting:
- Temperature¹ 75 – 110 °C
- Pressure² 2 – 4 bar
- Time 10 – 480 s
