Chemask NA Non-Ammoniated Solder Masking Agent is a fast curing, peelable temporary spot mask formulated for safe use on sensitive metals. It contains high-temperature resistant
compounds that protect component-free areas during wave soldering. Chemask NA may be used to protect pins, posts, contacts and edge connections in the solder reflow oven or during conformal coating processes.
FEATURES:
- Stable to 550°F (288°C)
- For lead-free or tin/lead processes
- Phthalate-free, low toxicity and environmentally safe
- Compatible with rosin, water soluble fluxes and cleaning solvents
- Dries tack free in 15 minutes
- Goes straight into the pre-heat oven
- Removes easily and leaves no residue
- Non-contaminating, non-staining and non-corrosive
- Compatible with gold, copper, nickel, silver and OSP finishes
- RoHS compliant
APPLICATIONS:
Chemask NA protects:
- Component-free areas during wave and reflow soldering
- Components and pin connectors
- Temperature sensitive components during wave or reflow soldering
- Component Free Areas, Components, Pin Connectors, Temperature Sensitive Components, SMT
| Base Material | Synthetic Resin |
| Color | Green |
| Odor | Odorless |
| Flux Compatibility | All types |
| Process Compatibility | Wave Soldering & Reflow |
| Solder Compatibility | Lead Free & Tin/Lead |
| Temperature Stability | 550°F/ 288ºC |
| Tack-Free Drying Time (10 mils @ 77°F/25ºC) |
15 mins |
| Cure Time (10 mils @ 77°F/25ºC) |
30 mins |
| Viscosity (@ 77°F) | 20,000 cps |
