Almit Flux Agents; The perfectly matched supplement for production and repair purposes. All Almit flux agents” properties correspond to those of all other Almit products, the composition of which eliminates crystallization. This is one of the preconditions to be met for applications in the aerospace industry including the NASA Space Shuttle
FEATURES:
- Flux gel “No clean”
- Ideally suited for BGA- and flip-chip assembly and reworking
- Flux agent L1 classified
- Can be applied by means of stencil plate or dispenser.
APPLICATIONS:
- Support soldering
Solids Content | 60.0% | |
Specific Weight | 1.081 | |
Flux gel | “No clean” | |
Flux Type | L1 | J-STD-0004 |
State | High viscosity liquid | This is in a Gel state. |
Colour | Light Yellow colour | |
Specific Gravity | 1.081 + 0.005 | 26°C |
Viscosity | 25,000 + 10,000cp | EHD-Type 2.5rpm 30, 26°C |
Copper Plate Corrosion Test | Pass | JIS-Z-3197 |
Chloride and Bromide Test | Pass | MIL-F-14256E |
Insulating Resistance | > 1 x 1012 Ω | JIS-Z-3197 |
Humidity Resistance at High Voltage | > 1 x 1012 Ω | JIS-Z-3197 |
Solution Resistance | > 100,000 Ω FLUX | MIL-F-14256E |
Spreadability on Copper Plate | > 80 % | MIL-F-14256E |